Sciences, Technology & Medicine
3D IC Integration and Packaging (ELECTRONICS)
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Product Description
By Lau, John H., Ph.D.. Published by McGraw-Hill Professional Pub. Format: Hardcover. Edition: 1. 458 pages. Language: english. Published: 2015-08-27.
Book Specifications
| ISBN-13 | 9780071848060 |
| ISBN-10 | 0071848061 |
| Publisher | McGraw-Hill Professional Pub |
| Language | english |
| Print Length | 458 pages |
| Category | Sciences, Technology & Medicine |
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