Engineering
Chemical-Mechanical Polishing - Fundamentals and Challenges (English, S. V. Babu)
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Product Description
About the Book
Chemical-mechanical planarization (CMP) has emerged over the past few years as a key enabling technology in the relentless drive of the semiconductor industry towards smaller, faster and less expensive interconnects. However, there are still many gaps in the fundamental understanding of the overall CMP process and the associated defect and contamination issues. This book brings together many of the active players in the field to focus on the inte…
ISBN: 9781558994737
Book Specifications
| ISBN-13 | 9781558994737 |
| ISBN-10 | 1558994734 |
| Publisher | Cambridge University Press |
| Category | Engineering |
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